Book Chapters
- T. Noulis (Editor), “Noise Coupling in System-on-Chip”, CRC Press, 2017 (Vasileios Gerakis, Alkis Hatzopoulos, “Coupling through substrate for millimeter wave frequencies”) (invited) (link)
Journal Papers
- Vasileios Gerakis, Alkis Hatzopoulos, “Interconnections Coupling through Substrate for Frequencies up to 100GHz”, International Journal of Microelectronics and Computer Science, 2014.
- Vasileios Gerakis, Alkis Hatzopoulos, “Improved Transmission Line Model for High Frequency Modelling of Through Silicon Vias”, International Journal of Electronics, 2019 (link).
- Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis Hatzopoulos, “A Low‑Cost, Robust and Tolerant, Digital Scheme for Post‑Bond Testing and Diagnosis of TSVs”, Journal of Electronic Testing, Springer, 2021 (link).
Conference Papers
- Vasileios Gerakis, Christina Avdikou, Alexandros Liolios, Alkis Hatzopoulos,”Modeling and analysis of Through Silicon Via (TSV) Interconnections”, IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS), p.p. 310-313, 2014.
- Vasileios Gerakis, Alexandros Liolios, Alkis Hatzopoulos, “Modeling of Partially Cracked and Void Hole Defected Through Silicon Via Interconnections”, Conference on Design of Circuits and Integrated Circuits (DCIS), 2014.
- Vasileios Gerakis, Fontounasios Christos, Alkis Hatzopoulos, “Analysis of Substrate Noise Coupling for Frequencies up to 100GHz”, Conference on Design of Circuits and Integrated Circuits (DCIS), 2014.
- Vasileios Gerakis, Alkis Hatzopoulos, “Substrate coupling noise considerations for frequencies up to 100GHz”, Proceedings of the 21st International Conference Mixed Design of Integrated Circuits & Systems (MIXDES), p.p. 351-355, 2014.
- Vasileios Gerakis, Christos Fontounasios, Alkis Hatzopoulos, “Modeling the Coupling through Substrate for Frequencies up to 100GHz”, IEEE 18th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS), p.p. 165-168, 2015.
- Vasileios Gerakis, Leonidas Katselas, Alkis Hatzopoulos, “Fault modeling and testing of through silicon via interconnections”, IEEE 21st International On-Line Testing Symposium (IOLTS), p.p. 30-31, 2015.
- Vasileios Gerakis, Alkis Hatzopoulos, “Interconnection Coupling on Lightly Doped Substrate for Millimeter Wave Frequencies”, Conference on Design of Circuits and Integrated Circuits (DCIS), 2015.
- Vasileios Gerakis, Fontounasios Christos, Alkis Hatzopoulos, “Substrate Coupling in Milimeter Wave Frequencies”, 17th International Conference on Electronics and Communication Engineering (ICECE), 2015.
- Vasileios Gerakis, Fontounasios Christos, Alkis Hatzopoulos, “Isolation Techniques on Lightly Doped Substrate For Frequencies up to 100GHz”, 3d Pan-Hellenic Conference on Electronics and Telecommunications (PACET), 2015.
- Sgourenas, Aik. Kalaitzopoulou, L.Mountrichas, L.Katselas, K.Giannakidis, V.Gerakis, Athanasiadis, G.Kalivas, K.Moustakas, A.Hatzopoulos, V.Gavriilidou, S.Siskos, “A Millimeter Wave PLL for E-band communications systems in 65nm CMOS”, 3d Pan-Hellenic Conference on Electronics and Telecommunications (PACET), 2015.
- Vasileios Gerakis, Leonidas Katselas, Alkis Hatzopoulos, “Through Silicon Via Fault Detection and Characterization”, 5th International Conference on Modern Circuits and Systems Technologies (MOCAST), 2016
- Stylianos Papadopoulos, Vasileios Gerakis, Alkis Hatzopoulos, “Oscillation-based Technique for TSV Post-bond Test Considerations”, 6th International Conference on Modern Circuits and Systems Technologies (MOCAST), 2017
- Stylianos Papadopoulos, Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis Hatzopoulos, “Oscillation-based Technique for Post-Bond Parallel Testing and Diagnosis of Multiple TSVs “, 27th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), 2017
- Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis Hatzopoulos, “On the Improvement of a TSV Post-bond Testing Method”, Pan-Hellenic Conference on Electronics and Telecommunications (PACET), 2019.
- Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis Hatzopoulos, “An Alternative Post-bond Testing Method for TSVs”, International Conference on Modern Circuits and Systems Technologies (MOCAST), 2020.