Publications

Book Chapters

  1. T. Noulis (Editor), “Noise Coupling in System-on-Chip”, CRC Press, 2017 (Vasileios Gerakis, Alkis Hatzopoulos, “Coupling through substrate for millimeter wave frequencies”) (invited) (link)

Journal Papers

  1. Vasileios Gerakis, Alkis Hatzopoulos, “Interconnections Coupling through Substrate for Frequencies up to 100GHz”, International Journal of Microelectronics and Computer Science, 2014.
  2. Vasileios Gerakis, Alkis Hatzopoulos, “Improved Transmission Line Model for High Frequency Modelling of Through Silicon Vias”, International Journal of Electronics, 2019 (link).
  3. Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis Hatzopoulos, “A Low‑Cost, Robust and Tolerant, Digital Scheme for Post‑Bond Testing and Diagnosis of TSVs”, Journal of Electronic Testing, Springer, 2021 (link).

Conference Papers

  1. Vasileios Gerakis, Christina Avdikou, Alexandros Liolios, Alkis Hatzopoulos,”Modeling and analysis of Through Silicon Via (TSV) Interconnections”, IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS), p.p. 310-313, 2014.
  2. Vasileios Gerakis, Alexandros Liolios, Alkis Hatzopoulos, “Modeling of Partially Cracked and Void Hole Defected Through Silicon Via Interconnections”, Conference on Design of Circuits and Integrated Circuits (DCIS), 2014.
  3. Vasileios Gerakis, Fontounasios Christos, Alkis Hatzopoulos, “Analysis of Substrate Noise Coupling for Frequencies up to 100GHz”, Conference on Design of Circuits and Integrated Circuits (DCIS), 2014.
  4. Vasileios Gerakis, Alkis Hatzopoulos, “Substrate coupling noise considerations for frequencies up to 100GHz”, Proceedings of the 21st International Conference Mixed Design of Integrated Circuits & Systems (MIXDES), p.p. 351-355, 2014.
  5. Vasileios Gerakis, Christos Fontounasios, Alkis Hatzopoulos, “Modeling the Coupling through Substrate for Frequencies up to 100GHz”, IEEE 18th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS), p.p. 165-168, 2015.
  6. Vasileios Gerakis, Leonidas Katselas, Alkis Hatzopoulos, “Fault modeling and testing of through silicon via interconnections”, IEEE 21st International On-Line Testing Symposium (IOLTS), p.p. 30-31, 2015.
  7. Vasileios Gerakis, Alkis Hatzopoulos, “Interconnection Coupling on Lightly Doped Substrate for Millimeter Wave Frequencies”, Conference on Design of Circuits and Integrated Circuits (DCIS), 2015.
  8. Vasileios Gerakis, Fontounasios Christos, Alkis Hatzopoulos, “Substrate Coupling in Milimeter Wave Frequencies”, 17th International Conference on Electronics and Communication Engineering (ICECE), 2015.
  9. Vasileios Gerakis, Fontounasios Christos, Alkis Hatzopoulos, “Isolation Techniques on Lightly Doped Substrate For Frequencies up to 100GHz”, 3d Pan-Hellenic Conference on Electronics and Telecommunications (PACET), 2015.
  10. Sgourenas, Aik. Kalaitzopoulou, L.Mountrichas, L.Katselas, K.Giannakidis, V.Gerakis, Athanasiadis, G.Kalivas, K.Moustakas, A.Hatzopoulos, V.Gavriilidou, S.Siskos, “A Millimeter Wave PLL for E-band communications systems in 65nm CMOS”, 3d Pan-Hellenic Conference on Electronics and Telecommunications (PACET), 2015.
  11. Vasileios Gerakis, Leonidas Katselas, Alkis Hatzopoulos, “Through Silicon Via Fault Detection and Characterization”,  5th International Conference on Modern Circuits and Systems Technologies (MOCAST), 2016
  12. Stylianos Papadopoulos, Vasileios Gerakis, Alkis Hatzopoulos, “Oscillation-based Technique for TSV Post-bond Test Considerations”,  6th International Conference on Modern Circuits and Systems Technologies (MOCAST), 2017
  13. Stylianos Papadopoulos, Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis Hatzopoulos, “Oscillation-based Technique for Post-Bond Parallel Testing and Diagnosis of Multiple TSVs “,  27th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), 2017
  14. Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis Hatzopoulos, “On the Improvement of a TSV Post-bond Testing Method”, Pan-Hellenic Conference on Electronics and Telecommunications (PACET), 2019.
  15. Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis Hatzopoulos, “An Alternative Post-bond Testing Method for TSVs”, International Conference on Modern Circuits and Systems Technologies (MOCAST), 2020.

Electrical & Computer Engineer